@@ -46,7 +46,7 @@ governed by the total heat you can dissipate across the tiny die surface. Due
to this limitation hardware architects trade cores for frequency, from 3.6 GHz
in Pentium D to 2 GHz nowadays. To achieve a performance
increase the engineers silently increased the TDP (Thermal design power) from
96W in Nehalem to 205W in Cascadelake. With standard DRAM technology you
96W in Nehalem to 205W in Cascadelake. The memory bandwidth was significantly increased over the years by adding more memory channels, but also by increasing the memory clock. With standard DRAM technology you
achieve more than 150GB/s on one socket. And with High Bandwidth Memory
(HBM) used in some HPC chips (e.g., NEC Aurora and Fujitsu A64FX) 1 TB/s and
more is possible. The next years will show what engineers have to offer to
